Mijing Z20 Pro Middle Layer Tin Planting Platform For iPhone X-13 Pro Max

The Mijing Z20 Pro Middle Layer Tin Planting Platform is designed for reballing BGA components on iPhone X-13 Pro Max motherboards. This 14 in 1 BGA reballing stencil platform offers a convenient and faster solution for reballing BGA without causing any damage.

With this platform, you can easily reball BGA components on iPhone X/XS/XS MAX/11/11 PRO/11 PRO MAX/12/12 PRO/12 PRO MAX/12 MINI/13/13 PRO/13 PRO MAX/13 MINI motherboards, making soldering repair quick and efficient.

Key Features:

• 14 in 1 BGA reballing stencil platform
• Suitable for iPhone X-13 Pro Max
• Convenient and faster reballing solution
• No damage to BGA components
• Best solution for motherboard BGA reballing soldering repair